Technology Highlight Strong Capacity for developing and implementing 5G RF Chips
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01
Wafer Materials Designing
Designing proprietary Wafer materials allows WiPAM to develop components with ideal thickness and doping levels
- WiPAM’s Wafer structures enable unique configuration, yielding non-replicable products with optimal performance
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02
Semiconductor Fabrication Process Development
Partnering with foundries to co-develop device fabrication processes (transferring its know-how in device designing and process development)
- Securing technological leadership through optimization of device properties
- Delivering ideal product performance through proprietary development of devices and fabrication processes
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03
Designing High-Efficiency Power Amplifier Circuits
Capacity for designing proprietary high-efficiency power amplifier circuits
- WiPAM’s distinguished circuit-designing capacity ensures the development of components with unrivaled performance
- Size optimization provides superior price competitiveness